10M40DAF672C8G vs 10M40DAF484C7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M40DAF672C8G disebabkan oleh Intel dan 10M40DAF484C7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M40DAF672C8G | 10M40DAF484C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements | 40,000 | — |
| Embedded Memory (bits) | 1,290,240 | 1,290,240 |
| User Flash (bits) | 1,290,240 | — |
| Maximum User I/O | 500 | — |
| Kemasan | 672-ball FBGA (F672) | 484-BGA (FineLine BGA) |
| Process Technology | 55 nm | — |
| Core Voltage | 1.2 V | — |
| Configuration Method | On-die flash (instant-on) | — |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL | — |
| Suhu Operasi | 0 C to +85 C (commercial) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | 3 (168 hours) | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements (LE) | — | 40,000 |
| User I/Os | — | 360 |
| DSP Blocks | — | 4 |
| Configuration Memory | — | Internal flash, dual-image capable |
| On-chip ADC | — | 12-bit, integrated |
| Temperature Range | — | Commercial (C7G suffix) |
| Process Node | — | 55 nm embedded flash |
| Moisture Sensitivity (MSL) | — | [DATA_NEEDED: MSL level] |
| Supported Design Tool | — | Intel Quartus Prime |