10M40DCF256C8G vs 10M50DCF256C8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M40DCF256C8G disebabkan oleh Intel dan 10M50DCF256C8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M40DCF256C8G | 10M50DCF256C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | — |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 40,000 | 50,000 |
| Embedded Memory (bits) | 1,290,240 | — |
| Jenis Ingatan | Embedded SRAM (block RAM) | — |
| Number of I/O | 178 (MAX) | — |
| Number of Logic Blocks / LABs | [DATA_NEEDED: LAB count] | — |
| Number of Registers | [DATA_NEEDED: register count] | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | 4 |
| On-die Flash | Yes (non-volatile configuration) | — |
| Integrated ADC | Yes (MAX 10 family feature) | — |
| Process Technology | 55 nm | TSMC 55 nm embedded flash CMOS |
| Core Voltage | 1.2 V | 1.0 V (internal) |
| Supply Voltage Range | [DATA_NEEDED: VCCINT/VCCIO range] | — |
| Speed Grade | -8 (fastest commercial) | 8 |
| Suhu Operasi | 0 °C to 85 °C (TJ, commercial, C-suffix) | — |
| Kemasan | 256-FBGA (F256, 17 mm × 17 mm) | 256-pin FBGA (FBGA256), 17x17 mm |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Terminal Finish | Lead-free / Pb-free (G suffix, RoHS) | — |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration Method | On-die flash (instant-on) | On-die non-volatile flash (instant-on); dual-boot supported |
| Design Tool | Intel Quartus Prime (Lite / Standard / Pro) | — |
| AEC-Q100 | Not qualified (use I-suffix variants for industrial) | — |
| Embedded Memory | — | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) |
| User Flash Memory | — | 1,677,312 bits |
| DSP Blocks (18x18 Multipliers) | — | 172 |
| Maximum User I/O Pins | — | 178 |
| Temperature Grade | — | Commercial (C suffix) |
| Hard ADC Blocks | — | 2 (12-bit, 1 MSPS) |
| I/O Bank Voltage | — | 2.5 V / 3.3 V (LVCMOS compatible) |