10M40DCF256C8G vs 10M50DCF256C8G 比較
詳細並排比較 10M40DCF256C8G 由 Intel 與 10M50DCF256C8G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10M40DCF256C8G | 10M50DCF256C8G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Series | MAX 10 | — |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 40,000 | 50,000 |
| Embedded Memory (bits) | 1,290,240 | — |
| 記憶體類型 | Embedded SRAM (block RAM) | — |
| Number of I/O | 178 (MAX) | — |
| Number of Logic Blocks / LABs | [DATA_NEEDED: LAB count] | — |
| Number of Registers | [DATA_NEEDED: register count] | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | 4 |
| On-die Flash | Yes (non-volatile configuration) | — |
| Integrated ADC | Yes (MAX 10 family feature) | — |
| Process Technology | 55 nm | TSMC 55 nm embedded flash CMOS |
| Core Voltage | 1.2 V | 1.0 V (internal) |
| Supply Voltage Range | [DATA_NEEDED: VCCINT/VCCIO range] | — |
| Speed Grade | -8 (fastest commercial) | 8 |
| 工作溫度 | 0 °C to 85 °C (TJ, commercial, C-suffix) | — |
| 封裝 | 256-FBGA (F256, 17 mm × 17 mm) | 256-pin FBGA (FBGA256), 17x17 mm |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Terminal Finish | Lead-free / Pb-free (G suffix, RoHS) | — |
| MSL 等級 | [DATA_NEEDED: MSL level] | — |
| RoHS 狀態 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration Method | On-die flash (instant-on) | On-die non-volatile flash (instant-on); dual-boot supported |
| Design Tool | Intel Quartus Prime (Lite / Standard / Pro) | — |
| AEC-Q100 | Not qualified (use I-suffix variants for industrial) | — |
| Embedded Memory | — | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) |
| User Flash Memory | — | 1,677,312 bits |
| DSP Blocks (18x18 Multipliers) | — | 172 |
| Maximum User I/O Pins | — | 178 |
| Temperature Grade | — | Commercial (C suffix) |
| Hard ADC Blocks | — | 2 (12-bit, 1 MSPS) |
| I/O Bank Voltage | — | 2.5 V / 3.3 V (LVCMOS compatible) |