10M50DAF256I7G vs 10M50DAF484I7P Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DAF256I7G disebabkan oleh Intel dan 10M50DAF484I7P disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DAF256I7G | 10M50DAF484I7P |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | — |
| Logic Elements (LE) | 50,000 | 50,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (M9K bits) | 1,677,312 | — |
| DSP Blocks (18 x 18 multipliers) | 4 | — |
| Maximum User I/O | 178 | — |
| Kemasan | 256-LBGA (17 mm x 17 mm) | 484-ball FineLine BGA (F484) |
| Configuration Memory | Internal non-volatile flash (dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | — |
| PLLs | On-chip (4 typical for 10M50 family) | 8 (general-purpose, fractional on selected devices) |
| Core Voltage | 1.2 V | — |
| Suhu Operasi | -40C to +100C (Industrial) | -40C to +100C (Tj, industrial) |
| Process Technology | TSMC 55 nm embedded flash | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Tray Quantity | 90 per tray (typical for 256-BGA) | — |
| Status RoHS | Compliant | Compliant |
| Configuration Mode | Internal flash (instant-on) | — |
| Product Family | — | MAX 10 |
| Embedded Memory (bits) | — | 1,677,312 |
| Embedded Memory Blocks | — | M9K (and M144K) |
| 18x18 Multipliers | — | 312 |
| User I/O Pins (max) | — | 360 |
| Pitch | — | 1.0 mm |
| Process Node | — | 55 nm embedded flash (TSMC) |
| On-die Configuration Flash | — | Yes (non-volatile, instant-on) |
| On-die ADC | — | Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs |
| Global Clock Networks | — | 20 |
| Speed Grade | — | 7 (slowest industrial bin, highest margin) |
| Configuration Modes | — | Internal flash, JTAG, dual-boot image support |