10M50DAF672I7G vs 10M40DAF672C8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DAF672I7G disebabkan oleh Intel dan 10M40DAF672C8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DAF672I7G | 10M40DAF672C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | — |
| Logic Elements (LE) | 50,000 | — |
| Embedded Memory (Bits) | 1,677,312 | — |
| Maximum User I/O | 500 | 500 |
| Bilangan Pin | 672 | — |
| Kemasan | 672-FBGA (FineLine BGA, 27 mm × 27 mm, 1.0 mm pitch) | 672-ball FBGA (F672) |
| Process Technology | 55 nm CMOS | 55 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Configuration Memory | Internal Flash (dual-configuration) | — |
| Multipliers (18×18) | 144 | — |
| PLLs | 4 | — |
| Hard Memory Controllers | 2 | — |
| Integrated ADC | Yes (12-bit SAR) | — |
| Suhu Operasi | -40 °C to +100 °C (Industrial, I7G) | 0 C to +85 C (commercial) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Family | — | MAX 10 FPGA |
| Logic Elements | — | 40,000 |
| Embedded Memory (bits) | — | 1,290,240 |
| User Flash (bits) | — | 1,290,240 |
| Configuration Method | — | On-die flash (instant-on) |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL |
| Aras MSL | — | 3 (168 hours) |
| Lead-Free | — | Yes |