10M50DAF672I7G vs 10M40DAF672C8G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M50DAF672I7G sa pamamagitan ng Intel at 10M40DAF672C8G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M50DAF672I7G | 10M40DAF672C8G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | MAX 10 | — |
| Logic Elements (LE) | 50,000 | — |
| Embedded Memory (Bits) | 1,677,312 | — |
| Maximum User I/O | 500 | 500 |
| Bilang ng Pins | 672 | — |
| Packhaging | 672-FBGA (FineLine BGA, 27 mm × 27 mm, 1.0 mm pitch) | 672-ball FBGA (F672) |
| Process Technology | 55 nm CMOS | 55 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Configuration Memory | Internal Flash (dual-configuration) | — |
| Multipliers (18×18) | 144 | — |
| PLLs | 4 | — |
| Hard Memory Controllers | 2 | — |
| Integrated ADC | Yes (12-bit SAR) | — |
| Temperature na Operasyon | -40 °C to +100 °C (Industrial, I7G) | 0 C to +85 C (commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Family | — | MAX 10 FPGA |
| Logic Elements | — | 40,000 |
| Embedded Memory (bits) | — | 1,290,240 |
| User Flash (bits) | — | 1,290,240 |
| Configuration Method | — | On-die flash (instant-on) |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL |
| Level ng MSL | — | 3 (168 hours) |
| Lead-Free | — | Yes |