10M50DCF256A7G vs 10M08DCF256A7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DCF256A7G disebabkan oleh Intel dan 10M08DCF256A7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DCF256A7G | 10M08DCF256A7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | — |
| Logic Elements (LE) | 50,000 | — |
| User Flash Memory | 1,677,312 bits | — |
| User I/O Count | 178 | — |
| Kemasan | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch | 256-LBGA (FineLine BGA, F256) |
| Process Node | 55 nm | — |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltages | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Suhu Operasi | -40 C to +85 C (industrial) | — |
| Speed Grade | 7 (DCF = dual-supply, commercial/industrial) | -7 |
| Embedded Memory | M9K blocks, 9 Kbits each | 378 Kbit (M9K blocks) |
| Embedded Multipliers | 144 x 18 x 18 | — |
| PLL | 4 | — |
| On-chip ADC | 12-bit, 1 MSPS, 16 channels | — |
| Configuration | Internal flash (single-chip, instant-on) | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 (168 hours) | — |
| Series | — | MAX 10 |
| Logic Elements | — | 8,000 LE |
| Total RAM Bits | — | 387,072 bits |
| User I/Os | — | 178 |
| Operating Supply Voltage (Core) | — | 1.2 V |
| Process Technology | — | 55 nm |
| Gaya Pemasangan | — | SMD/SMT |
| Temperature Grade | — | Automotive (-40C to +125C) |
| Configuration Memory | — | On-die dual-configuration flash (non-volatile) |
| Lead Free | — | Yes |
| Integrated ADC | — | 12-bit, 1 MSPS, 16-channel (per family) |