5CSEBA6U23C8SN vs 5CSEBA2U23C8SN Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 5CSEBA6U23C8SN disebabkan oleh Intel dan 5CSEBA2U23C8SN disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 5CSEBA6U23C8SN | 5CSEBA2U23C8SN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone V SE SoC FPGA | — |
| Device Designator | 5CSEBA6 (U23 speed grade, 8 speed) | — |
| Logic Elements | 110,000 | 25,000 |
| HPS Processor | Single ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 600 MHz | 600 MHz |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| DSP Blocks | 224 (18x18 multipliers) | — |
| Embedded Memory | 4.45 Mbits (M10K + MLAB) | — |
| Hard Memory Controller | DDR2/DDR3 with ECC (HPS) | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, NAND, SD/MMC, I2C, SPI, UART | EMAC, USB 2.0 OTG, SPI, I2C, UART, SD/MMC, NAND |
| Maximum User I/O | [DATA_NEEDED: user I/O count for U23 package] | — |
| LVDS Channels | Up to 17 (875 Mbps) | — |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm low-power |
| Suhu Operasi | [DATA_NEEDED: operating temperature grade] | — |
| Kemasan | 672-ball UBGA (23x23 mm) | 672-ball UBGFA (UFBGA), 23 x 23 mm |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Device Family | — | Cyclone V SE SoC FPGA |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Core Voltage | — | 1.1 V (typical) |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| User I/O Pins | — | 145 (per Avaq comparison reference) |
| Memory Interfaces | — | DDR3, LPDDR2, QSPI flash |
| Debug Support | — | ARM CoreSight JTAG and trace |
| Lead Free | — | Yes |