5CSEBA6U23C8SN vs 5CSEBA2U23C8SN 比較
詳細並排比較 5CSEBA6U23C8SN 由 Intel 與 5CSEBA2U23C8SN 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 5CSEBA6U23C8SN | 5CSEBA2U23C8SN |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone V SE SoC FPGA | — |
| Device Designator | 5CSEBA6 (U23 speed grade, 8 speed) | — |
| Logic Elements | 110,000 | 25,000 |
| HPS Processor | Single ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 600 MHz | 600 MHz |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| DSP Blocks | 224 (18x18 multipliers) | — |
| Embedded Memory | 4.45 Mbits (M10K + MLAB) | — |
| Hard Memory Controller | DDR2/DDR3 with ECC (HPS) | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, NAND, SD/MMC, I2C, SPI, UART | EMAC, USB 2.0 OTG, SPI, I2C, UART, SD/MMC, NAND |
| Maximum User I/O | [DATA_NEEDED: user I/O count for U23 package] | — |
| LVDS Channels | Up to 17 (875 Mbps) | — |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm low-power |
| 工作溫度 | [DATA_NEEDED: operating temperature grade] | — |
| 封裝 | 672-ball UBGA (23x23 mm) | 672-ball UBGFA (UFBGA), 23 x 23 mm |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 等級 | [DATA_NEEDED: MSL rating] | — |
| RoHS 狀態 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Device Family | — | Cyclone V SE SoC FPGA |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Core Voltage | — | 1.1 V (typical) |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| User I/O Pins | — | 145 (per Avaq comparison reference) |
| Memory Interfaces | — | DDR3, LPDDR2, QSPI flash |
| Debug Support | — | ARM CoreSight JTAG and trace |
| Lead Free | — | Yes |