A3P600-1FGG144 vs A3P600-1FG144I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3P600-1FGG144 disebabkan oleh Microchip Technology dan A3P600-1FG144I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | A3P600-1FGG144 | A3P600-1FG144I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3 | ProASIC3 |
| Total Gates | 600,000 | — |
| Logic Elements (CLBs) | 13,824 | — |
| Number of I/Os | 97 | — |
| Embedded RAM | 110,592 bits | — |
| Core Supply Voltage | 1.5 V | 1.5V |
| Maximum System Performance | 350 MHz | 272 MHz |
| Kemasan | 144-LBGA (FBGA) | — |
| Package Pitch | 1.00 mm | 1 mm |
| Gaya Pemasangan | SMD/SMT | — |
| Gambaran Suhu Operasi | 0 C to +70 C | 0°C to 70°C |
| Packaging | Tray | — |
| I/O Banks | 4 | — |
| Configuration | Flash-based (non-volatile) | — |
| Status RoHS | Compliant | Compliant |
| System Gates | — | 600000 |
| Technology | — | 130nm |
| User I/Os | — | 97 |
| RAM Bits | — | 110592 |
| Logic Elements / CLBs | — | 13824 |
| Package Type | — | FBGA-144 |
| Logic Family | — | CMOS |
| Jenis Pemasangan | — | Surface Mount |
| Lead-Free | — | Yes |