A3P600-FGG144I vs A3P600-1FGG144 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3P600-FGG144I disebabkan oleh Microchip Technology dan A3P600-1FGG144 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | A3P600-FGG144I | A3P600-1FGG144 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600000 | — |
| Logic Modules (Tiles) | 13824 | — |
| RAM Bits | 110592 | — |
| User I/Os | 97 | — |
| Core Voltage | 1.5 V | — |
| Maximum System Performance | 231 MHz | 350 MHz |
| Kemasan | 144-pin FBGA (FGG144) | 144-LBGA (FBGA) |
| Jenis Pemasangan | Surface Mount | — |
| Suhu Operasi | -40C to +100C (industrial) | — |
| Process Technology | 130nm flash | — |
| PLLs | 3 | — |
| I/O Standards | LVCMOS, LVTTL, PCI, etc. | — |
| Status RoHS | Compliant (lead-free) | Compliant |
| Standard Package | 160 (tray) | — |
| Total Gates | — | 600,000 |
| Logic Elements (CLBs) | — | 13,824 |
| Number of I/Os | — | 97 |
| Embedded RAM | — | 110,592 bits |
| Core Supply Voltage | — | 1.5 V |
| Package Pitch | — | 1.00 mm |
| Gaya Pemasangan | — | SMD/SMT |
| Gambaran Suhu Operasi | — | 0 C to +70 C |
| Packaging | — | Tray |
| I/O Banks | — | 4 |
| Configuration | — | Flash-based (non-volatile) |