A3P600-FGG144I vs A3P600-1FGG144 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P600-FGG144I sa pamamagitan ng Microchip Technology at A3P600-1FGG144 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P600-FGG144I - 600K Gate ProASIC3 FPGA | Microchip
A3P600-FGG144I ✓ NakahandaMicrochip Technology
A3P600-1FGG144 - 600K Gate ProASIC3 FPGA | Microchip
A3P600-1FGG144 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P600-FGG144I | A3P600-1FGG144 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600000 | — |
| Logic Modules (Tiles) | 13824 | — |
| RAM Bits | 110592 | — |
| User I/Os | 97 | — |
| Core Voltage | 1.5 V | — |
| Maximum System Performance | 231 MHz | 350 MHz |
| Packhaging | 144-pin FBGA (FGG144) | 144-LBGA (FBGA) |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | -40C to +100C (industrial) | — |
| Process Technology | 130nm flash | — |
| PLLs | 3 | — |
| I/O Standards | LVCMOS, LVTTL, PCI, etc. | — |
| Tindminan RoHS | Compliant (lead-free) | Compliant |
| Standard Package | 160 (tray) | — |
| Total Gates | — | 600,000 |
| Logic Elements (CLBs) | — | 13,824 |
| Number of I/Os | — | 97 |
| Embedded RAM | — | 110,592 bits |
| Core Supply Voltage | — | 1.5 V |
| Package Pitch | — | 1.00 mm |
| Style ng Pagpapasok | — | SMD/SMT |
| Hanay ng Temperature na Operasyon | — | 0 C to +70 C |
| Packaging | — | Tray |
| I/O Banks | — | 4 |
| Configuration | — | Flash-based (non-volatile) |