A3PE3000-1FGG896 vs A3PE3000L-FGG896I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000-1FGG896 disebabkan oleh Microchip Technology dan A3PE3000L-FGG896I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE3000-1FGG896 - ProASIC3E Flash FPGA 3M Gates 620 I/O | Microchip
A3PE3000-1FGG896 ✓ AktifMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE3000-1FGG896 | A3PE3000L-FGG896I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3E (Flash FPGA) | ProASIC3L |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells | 75,264 | — |
| User I/O | 620 | — |
| Speed Grade | -1 | Standard (no speed suffix) |
| Kemasan | 896-ball FBGA (FGG896) | — |
| Technology | Nonvolatile flash, CMOS | — |
| Configuration | Single-chip, Instant On (on-chip flash) | — |
| Reprogrammability | Yes (in-system reprogrammable flash fabric) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (SMD/SMT) |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | Industrial grade (I suffix) |
| Embedded Memory | [DATA_NEEDED: embedded block RAM capacity] | — |
| Lead Free | Yes (LEAD FREE per distributor listing) | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Country of Origin | South Korea (per MicrochipDirect for A3PE3000-1FG896 family variant) | — |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| Tegangan Pemberi Arus | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| Kemasan / Case | — | 896-BGA (FBGA, 1 mm pitch) |
| Packaging | — | Tray, standard quantity 27 |