A3PE3000-1FGG896 vs A3PE3000L-FGG896I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000-1FGG896 sa pamamagitan ng Microchip Technology at A3PE3000L-FGG896I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000-1FGG896 - ProASIC3E Flash FPGA 3M Gates 620 I/O | Microchip
A3PE3000-1FGG896 ✓ NakahandaMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000-1FGG896 | A3PE3000L-FGG896I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3E (Flash FPGA) | ProASIC3L |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells | 75,264 | — |
| User I/O | 620 | — |
| Speed Grade | -1 | Standard (no speed suffix) |
| Packhaging | 896-ball FBGA (FGG896) | — |
| Technology | Nonvolatile flash, CMOS | — |
| Configuration | Single-chip, Instant On (on-chip flash) | — |
| Reprogrammability | Yes (in-system reprogrammable flash fabric) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (SMD/SMT) |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | Industrial grade (I suffix) |
| Embedded Memory | [DATA_NEEDED: embedded block RAM capacity] | — |
| Lead Free | Yes (LEAD FREE per distributor listing) | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Country of Origin | South Korea (per MicrochipDirect for A3PE3000-1FG896 family variant) | — |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| Volte ng Pagbibigay | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| Packhaging / Kaso | — | 896-BGA (FBGA, 1 mm pitch) |
| Packaging | — | Tray, standard quantity 27 |