A3PE3000L-FG324I vs A3PE3000L-FGG324 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000L-FG324I disebabkan oleh Microchip Technology dan A3PE3000L-FGG324 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Microchip Technology
A3PE3000L-FG324I A3PE3000L-FG324I - 3M-Gate Flash FPGA, 221 I/O | Microchip

A3PE3000L-FG324I - 3M-Gate Flash FPGA, 221 I/O | Microchip

A3PE3000L-FG324I ✓ Aktif
Microchip Technology
A3PE3000L-FGG324 A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip

A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip

A3PE3000L-FGG324 ✓ Aktif

Pengandingan Spesifikasi

Parametr A3PE3000L-FG324I A3PE3000L-FGG324
Merek Microchip Technology Microchip Technology
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family ProASIC3L (Flash-based FPGA) ProASIC3L (Flash-based FPGA)
System Gates 3,000,000 3,000,000
Logic Cells (CLBs) 75264 75264
User I/O 221 221
Embedded SRAM 516096 bits (up to 144 kbits true dual-port blocks per family) —
Core Voltage 1.2 V (1.2 V to 1.5 V supported) —
Process Technology 130 nm CMOS, 7-layer metal (6 copper), flash-based —
Configuration Nonvolatile flash, Instant On (Level 0 support) —
Low Power Feature Flash*Freeze technology —
Max Frequency [DATA_NEEDED: maximum system frequency] —
JTAG Boundary Scan IEEE 1149.1 —
Input Option Schmitt Trigger on single-ended inputs —
Kemasan 324-ball FBGA (FG324), 19x19 mm 324-BGA / FBGA (FGG324)
Jenis Pemasangan Surface Mount —
Suhu Operasi -40C to +100C (Industrial, I suffix) 0 C to +70 C (commercial)
Status RoHS Non-Compliant (FG package contains lead) [DATA_NEEDED: RoHS status]
Lead Free Status Contains Lead —
Manufacturer Part Number — A3PE3000L-FGG324
Configuration Memory — On-chip Flash (single-chip, nonvolatile)
Core Voltage Range — 1.2 V to 1.5 V
Tegangan Pemberi Arus Operasi — 1.5 V
Maximum Operating Frequency — 250 MHz
Special Features — Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down
Boundary Scan — IEEE 1149.1 (JTAG)
Gaya Pemasangan — SMD/SMT
Packaging — Tray
Embedded RAM — [DATA_NEEDED: embedded RAM capacity]

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