A3PE3000L-FG896M vs A3PE3000-FG896 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000L-FG896M disebabkan oleh Microchip Technology dan A3PE3000-FG896 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE3000L-FG896M - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-FG896M ✓ AktifMicrochip Technology
A3PE3000-FG896 - ProASIC3E Flash FPGA 620 I/O | Microchip
A3PE3000-FG896 ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE3000L-FG896M | A3PE3000-FG896 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3L (ProASIC3EL) | ProASIC3E |
| Equivalent Gates | 3,000,000 | — |
| Logic Cells | 75,264 | — |
| User I/O | 620 | — |
| Process Technology | 130 nm CMOS flash | 130 nm |
| Core Voltage | 1.2 V / 1.5 V | — |
| Kemasan | 896-ball FBGA (FG896) | 896-BGA (FBGA) |
| Jenis Pemasangan | Surface Mount | — |
| Configuration Memory | On-chip flash (nonvolatile, single-chip) | Flash (non-volatile, reprogrammable) |
| Low-Power Technology | Flash*Freeze | — |
| JTAG Boundary Scan | IEEE 1149.1 | — |
| Input Type Option | Schmitt trigger on single-ended inputs | — |
| Pull Resistors | Weak pull-up / pull-down | — |
| Temperature Grade | M (military screening per suffix) | — |
| Gambaran Suhu Operasi | [DATA_NEEDED: Operating Temperature Range] | — |
| Embedded Block RAM | [DATA_NEEDED: Embedded Block RAM capacity] | — |
| Speed Grade | [DATA_NEEDED: Speed Grade] | Standard (-) |
| Status RoHS | [DATA_NEEDED: RoHS Status] | Non-green package (FG prefix; FGG variants are RoHS green) |
| System Gates | — | 3000000 |
| Number of I/O | — | 620 |
| Embedded Memory | — | 516096 bit |
| Maximum System Frequency | — | 231 MHz |
| Core Supply Voltage | — | 1.5 V |
| Logic Element Count (per distributor listing) | — | [DATA_NEEDED: verified LE/KLE count] |
| Gaya Pemasangan | — | SMD/SMT |
| Suhu Operasi | — | 0 C to +70 C |
| Packaging | — | Tray |
| Architecture | — | VersaTile 3-input LUT / D flip-flop / latch |
| Global Networks | — | VersaNet low-skew high-fanout networks |