Microchip Technology

A3PE3000L-FG896M - 3M-Gate Low-Power Flash FPGA | Microchip

MPN: A3PE3000L-FG896M ✓ Aktif
1.2 V / 1.5 V Vdss 896-ball FBGA (FG896) Package On-chip flash (nonvolatile, single-chip) Memory
MOQ: 1 |

A3PE3000L-FG896M Ringkasan

The Microchip (formerly Microsemi/Actel) A3PE3000L-FG896M is a 3-million-gate ProASIC3L low-power flash FPGA with 75,264 logic cells and 620 user I/O, fabricated on a 130nm CMOS flash process and housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package operating from a 1.2V/1.5V core supply.

A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions that do not require an external configuration PROM, power up instantly, and are inherently more secure because the bitstream is not stored externally. Within the power management hierarchy of programmable logic, the ProASIC3L family sits as Microchip's low-power variant of the ProASIC3/ProASIC3E families, adding Flash*Freeze technology.

Key differentiating features include Flash*Freeze technology, which allows the device to enter an ultra-low-power sleep mode while retaining state and waking in microseconds; 1.2V to 1.5V core operation for reduced dynamic and static power; single-chip reprogrammable flash configuration; Schmitt-trigger option on single-ended inputs; and weak pull-up/pull-down support on I/O.

Technically, the device uses a sea-of-gates flash architecture with versatile logic elements, embedded block RAM, and supports IEEE 1149.1 (JTAG) boundary scan testing. The pin-compatible package strategy across the ProASIC3L family (except PQ208) allows design migration between density grades without PCB rework.

Typical applications include military and aerospace systems, industrial automation, portable instrumentation, and low-power embedded control where nonvolatile single-chip configuration and minimal standby power are essential.

Design consideration: the M temperature grade suffix indicates a military-grade screening level; verify supply sequencing and use Microchip Libero SoC design tools for implementation.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.

Pilihan pengganti yang segera untuk A3PE3000L-FG896M — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.

Varietas dalam siri ini

Model serupa yang kompatibel dengan pengganti yang segera A3PE3000L-FG896M (sama faktor bentuk dan kaki) — berbeza dalam Family, Package, Configuration Memory, Process Technology, RoHS Status.

Microchip Technology
Family: ProASIC3E
Package: 896-BGA / 896-FBGA (31x31 mm, 1.0 mm ball pitch)
Configuration Memory: On-chip Flash (non-volatile, single chip)
Bandingkan Dengan A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3E
Package: 896-BGA (FBGA)
Configuration Memory: Flash (non-volatile, reprogrammable)
Bandingkan Dengan A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3L (Flash FPGA)
Package: 896-ball FBGA
Process Technology: 130 nm Flash
Bandingkan Dengan A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3L
Package: 896-ball FBGA
Configuration Memory: Nonvolatile flash (single-chip, Instant On)
Bandingkan Dengan A3PE3000L-FG896M →

Tiada pilihan pengganti yang segera untuk produk ini.

Minta Alternatif

A3PE3000L-FG896M Penilaian maksimum & Ciri-ciri Elektrik

Family ProASIC3L (ProASIC3EL)
Equivalent Gates 3,000,000
Logic Cells 75,264
User I/O 620
Process Technology 130 nm CMOS flash
Core Voltage 1.2 V / 1.5 V
Kemasan 896-ball FBGA (FG896)
Jenis Pemasangan Surface Mount
Configuration Memory On-chip flash (nonvolatile, single-chip)
Low-Power Technology Flash*Freeze
JTAG Boundary Scan IEEE 1149.1
Input Type Option Schmitt trigger on single-ended inputs
Pull Resistors Weak pull-up / pull-down
Temperature Grade M (military screening per suffix)

Panduan Konfigurasi Pin A3PE3000L-FG896M 896-ball fbga (fg896)

Konfigurasi pin untuk A3PE3000L-FG896M (896-ball fbga (fg896) pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.

Garis bentuk pengecah pakai 896-ball fbga (fg896) untuk A3PE3000L-FG896M

Tiada data garisan pin yang diperoleh untuk A3PE3000L-FG896M.

Rujuk kepada lembaran data untuk konfigurasi pin penuh.

Aplikasi Biasa

A3PE3000L-FG896M patut untuk 3 aplikasis: Sistem Ter嵌入式, Peranti IoT, Kawalan Industri.

🧩

Sistem Ter嵌入式

Pemrosesan utama dalam aplikasi ter嵌入式 menggunakan A3PE3000L-FG896M.

🌐

Peranti IoT

Peranti bersambung pintar yang dipower oleh A3PE3000L-FG896M.

🏭

Kawalan Industri

Sistem pengawalan dan automatik menggunakan A3PE3000L-FG896M.

Tiada FAQ tersedia untuk produk ini.

Data referensi kejuruteraan untuk A3PE3000L-FG896M — perbandingan, panduan rancangan, dan maklumat kesediaan

Maklumat Kesediaan

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Bosong logam timbal
Unknown
Bosong halogen
Unknown
Mineral konflik
Unknown

Compliance data not present in the provided web data.

Data disahkan pada: 2026-09-02 — data yang disahkan dan disusun semula oleh pasukan kejuruteraan komponen XAIPART

Komponen dan Tanda berkaitan

Microchip Technology Actel Corporation Microsemi Corporation A3PE3000L-FG896M ProASIC3L flash FPGA field-programmable gate array Flash*Freeze technology 896-ball FBGA IEEE 1149.1 JTAG 130nm CMOS SRAM FPGA low-power FPGA military FPGA boundary scan
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