A3PE3000L-FGG324I vs A3PE3000-2FGG324 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000L-FGG324I disebabkan oleh Microchip Technology dan A3PE3000-2FGG324 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Microchip Technology
A3PE3000L-FGG324I A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip

A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip

A3PE3000L-FGG324I ✓ Aktif
Microchip Technology
A3PE3000-2FGG324 A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-2FGG324 ✓ Aktif

Pengandingan Spesifikasi

Parametr A3PE3000L-FGG324I A3PE3000-2FGG324
Merek Microchip Technology Microchip Technology
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family ProASIC3L (Flash FPGA) ProASIC3E
System Gates 3,000,000 3000000
Total RAM Bits 516096 —
User I/O 221 221
Core Voltage 1.2 V to 1.5 V —
Process Technology 130 nm CMOS 130 nm CMOS flash
Kemasan 324-BGA FBGA (19x19 mm) 324-ball FBGA (FGG324)
Jenis Pemasangan Surface Mount (SMD) Surface Mount
Suhu Operasi -40C to +100C (industrial) [DATA_NEEDED: operating temperature range]
Technology Features Nonvolatile Flash, Instant On, Flash*Freeze —
Configuration Single-chip, no external boot PROM —
Packaging Tray —
Lead Free Status Lead Free —
Status RoHS RoHS Compliant Green (RoHS compliant)
Number of Package Balls 324 —
Logic Cells — 75264
CLBs — 75264
Maximum System Frequency — 310 MHz
Core Supply Voltage — 1.5 V
Configuration Memory — Flash (single-chip, instant-on)
Total Memory Bits — [DATA_NEEDED: embedded SRAM capacity]
Package Dimensions — 19 x 19 mm, 1 mm pitch, 1.63 mm height
Speed Grade — 2
Packaging Type — Tray
Automotive Qualification — Not qualified (standard grade)

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