A3PE3000L-FGG324I vs A3PE3000-FGG324I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000L-FGG324I disebabkan oleh Microchip Technology dan A3PE3000-FGG324I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-FGG324I ✓ AktifMicrochip Technology
A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FGG324I ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE3000L-FGG324I | A3PE3000-FGG324I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3L (Flash FPGA) | ProASIC3E (ProASIC3E Flash Family) |
| System Gates | 3,000,000 | 3000000 gates |
| Total RAM Bits | 516096 | — |
| User I/O | 221 | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Process Technology | 130 nm CMOS | — |
| Kemasan | 324-BGA FBGA (19x19 mm) | 324-BGA (FBGA/PBGA324), 19 x 19 mm |
| Jenis Pemasangan | Surface Mount (SMD) | Surface Mount |
| Suhu Operasi | -40C to +100C (industrial) | -40 C to +125 C (Industrial, I grade) |
| Technology Features | Nonvolatile Flash, Instant On, Flash*Freeze | — |
| Configuration | Single-chip, no external boot PROM | — |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Status RoHS | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Number of Package Balls | 324 | — |
| Logic Elements (CLBs) | — | 75264 |
| Total User I/O | — | 221 |
| Embedded Memory | — | 516096 bits |
| Maximum Frequency | — | 350 MHz |
| Core Supply Voltage | — | 1.5 V |
| Technology | — | 130 nm CMOS, nonvolatile flash |
| Ball Pitch | — | 1 mm |
| Package Height | — | 1.63 mm |
| Configuration Memory | — | Nonvolatile flash, reprogrammable, Instant-On |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL Level] |