A3PE600-2FGG256 vs A3PE600-FG256I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE600-2FGG256 disebabkan oleh Microchip Technology dan A3PE600-FG256I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE600-2FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
A3PE600-2FGG256 ✓ AktifMicrochip Technology
A3PE600-FG256I - 600K Gate Flash FPGA, 256-FBGA | Microchip
A3PE600-FG256I ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE600-2FGG256 | A3PE600-FG256I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3E Flash FPGA | ProASIC3E |
| System Gates | 600000 | — |
| Logic Elements (CLBs) | 13824 | — |
| Maximum System Frequency | 310 MHz | 350 MHz |
| Process Technology | 130 nm CMOS | — |
| Core Voltage | 1.5 V | — |
| Number of User I/O | 165 | 165 |
| Configuration Memory | On-chip Flash (non-volatile, single-chip) | Nonvolatile Flash (single-chip, live at power-up) |
| Speed Grade | -2 | Standard (-1) |
| Kemasan | 256-LBGA (FGG256) | 256-FBGA (LBGA), 17 x 17 mm, 1.0 mm pitch |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Reprogrammability | In-system reprogrammable | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | -40C to +100C (TJ), industrial |
| Embedded SRAM | [DATA_NEEDED: total embedded SRAM capacity] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards list] | — |
| Status RoHS | Compliant | RoHS Non-Compliant (contains lead; FGG variant is green) |
| Supply Voltage Class | 1.5 V core / 3.3 V I/O class | — |
| Logic Gates | — | 600000 |
| D Flip-Flops (DFFs) | — | 13824 |
| CLBs / VersaTiles | — | 13824 |
| Core Supply Voltage | — | 1.425 V to 1.575 V |
| Technology | — | 130 nm CMOS flash-based |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |