A3PE600-2FGG256 vs A3PE600-FG256I 比較
詳細並排比較 A3PE600-2FGG256 由 Microchip Technology 與 A3PE600-FG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
A3PE600-2FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
A3PE600-2FGG256 ✓ 啟用中Microchip Technology
A3PE600-FG256I - 600K Gate Flash FPGA, 256-FBGA | Microchip
A3PE600-FG256I ✓ 啟用中規格比較
| 參數 | A3PE600-2FGG256 | A3PE600-FG256I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | ProASIC3E Flash FPGA | ProASIC3E |
| System Gates | 600000 | — |
| Logic Elements (CLBs) | 13824 | — |
| Maximum System Frequency | 310 MHz | 350 MHz |
| Process Technology | 130 nm CMOS | — |
| Core Voltage | 1.5 V | — |
| Number of User I/O | 165 | 165 |
| Configuration Memory | On-chip Flash (non-volatile, single-chip) | Nonvolatile Flash (single-chip, live at power-up) |
| Speed Grade | -2 | Standard (-1) |
| 封裝 | 256-LBGA (FGG256) | 256-FBGA (LBGA), 17 x 17 mm, 1.0 mm pitch |
| 安裝類型 | Surface Mount | Surface Mount |
| Reprogrammability | In-system reprogrammable | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | -40C to +100C (TJ), industrial |
| Embedded SRAM | [DATA_NEEDED: total embedded SRAM capacity] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards list] | — |
| RoHS 狀態 | Compliant | RoHS Non-Compliant (contains lead; FGG variant is green) |
| Supply Voltage Class | 1.5 V core / 3.3 V I/O class | — |
| Logic Gates | — | 600000 |
| D Flip-Flops (DFFs) | — | 13824 |
| CLBs / VersaTiles | — | 13824 |
| Core Supply Voltage | — | 1.425 V to 1.575 V |
| Technology | — | 130 nm CMOS flash-based |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |