A54SX72A-2PQG208I vs A54SX72A-2PQ208I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A54SX72A-2PQG208I disebabkan oleh Microchip Technology dan A54SX72A-2PQ208I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A54SX72A-2PQG208I - 108K-Gate Antifuse FPGA, 171 I/O | Microchip
A54SX72A-2PQG208I ✓ AktifMicrochip Technology
A54SX72A-2PQ208I - 108K-Gate Antifuse FPGA, PQFP-208 | Microchip
A54SX72A-2PQ208I ✓ AktifPengandingan Spesifikasi
| Parametr | A54SX72A-2PQG208I | A54SX72A-2PQ208I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | SX-A (antifuse FPGA) | SX-A (antifuse FPGA) |
| System Gates | 108K | 108000 gates |
| User I/O | 171 | — |
| Speed Grade | -2 | -2 |
| Maximum Toggle/Operating Frequency | 217 MHz | — |
| Core Supply Voltage | 2.5 V | — |
| I/O Standards | TTL, LVTTL, LVCMOS2, 3.3 V PCI, 5 V PCI | — |
| Programming Technology | Antifuse (one-time programmable, non-volatile) | Antifuse (one-time programmable) |
| Kemasan | 208-BFQFP (PQFP-208, gull wing) | 208-Pin PQFP / BFQFP (28 x 28 mm) |
| Suhu Operasi | -40C to +85C (Industrial) | Industrial (-40C to +85C, I suffix) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Terminal Form | Gull Wing | — |
| Package Shape | Square | — |
| Status RoHS | Lead free (per Kynix listing) | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Number of Logic Cells/Modules | [DATA_NEEDED: module count] | — |
| Static Power | [DATA_NEEDED: static power] | — |
| Logic Modules / Cells | — | 4024 cells |
| Dedicated Flip-Flops | — | up to 2012 |
| Maximum System Frequency | — | 294 MHz |
| User I/O (this package) | — | 171 |
| Family Maximum User I/O | — | 360 |
| Tegangan Pemberi Arus | — | 2.5 V (2.25 V to 5.25 V I/O tolerance range per distributor data) |
| Process Technology | — | 0.25 um CMOS |
| Packaging | — | Tray |
| Clock Networks | — | CLKA, CLKB global plus quadrant QCLK networks |
| Configuration | — | Non-volatile, active at power-up, no external configuration device |