ATSAMA5D26C-CU vs ATSAMA5D27A-CUR Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci ATSAMA5D26C-CU disebabkan oleh Microchip Technology dan ATSAMA5D27A-CUR disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
ATSAMA5D26C-CU - 500MHz ARM Cortex-A5 MPU 289-LFBGA | Microchip
ATSAMA5D26C-CU ✓ AktifPengandingan Spesifikasi
| Parametr | ATSAMA5D26C-CU | ATSAMA5D27A-CUR |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Type | Microprocessor (MPU) | — |
| Core | ARM Cortex-A5 (32-bit, single-core) | ARM Cortex-A5 (1 core, 32-bit) |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| Internal SRAM | 128 KB | — |
| Internal ROM | 160 KB | — |
| L1 Cache | 32 KB I-cache + 32 KB D-cache | — |
| External Memory Support | DDR2 / DDR3L / LPDDR2 / LPDDR3, QSPI, e.MMC | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC |
| Kemasan | 289-LFBGA (14x14 mm, 0.8 mm ball pitch) | 289-LFBGA (14x14 mm) |
| Supply Voltage (Core) | 1.2 V | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Suhu Operasi | -40C to +85C (industrial) | -40 C to +85 C (Industrial, MRLA marking) |
| Backup Mode Current | ~5 µA (per SAMA5D2 family datasheet) | 5 uA (typ) |
| Security Features | Secure boot, HW AES/SHA/TRNG, tamper pins | — |
| Display Controller | 24-bit LCD up to 1024x768 | — |
| Connectivity | 2x GMAC, 2x CAN-FD, USB Host/Device, 11x UART, I2S, SPI, I2C | — |
| Camera Interface | MIPI CSI-2, 12-bit parallel | — |
| Status RoHS | Compliant | Compliant |
| Series | — | SAMA5D2 |
| Maximum Junction Temperature | — | 105 C |
| Ball Pitch | — | 0.8 mm |
| Cache | — | 32 KB I-cache, 32 KB D-cache |
| FPU / NEON | — | Yes (VFPv4 + NEON) |
| AES-OTF (On-The-Fly) | — | Yes |
| CAN-FD Controllers | — | 2 |
| HSIC Interface | — | Yes |
| Peripheral Touch Controller | — | Yes (PTC) |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Packaging | — | Tape & Reel (TR) |
| Aras MSL | — | 3 |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Embedded Audio Subsystem | — | Yes (I2S/TDM) |