DSP56311VF150 vs DSP56321VF200 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci DSP56311VF150 disebabkan oleh NXP Semiconductors dan DSP56321VF200 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | DSP56311VF150 | DSP56321VF200 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | DSP |
| Status Lingkungan Hidup | Obsolete | Akhir Hidup |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | DSP56300 (Symphony) | — |
| Type | Fixed-Point Digital Signal Processor | — |
| Core Clock Frequency | 150 MHz | — |
| Instruction Throughput | 150 MIPS | — |
| Multiply-Accumulate Performance | 300 MMACS | — |
| Lebar Bus Data | 24 bit | — |
| On-Chip RAM | 384 KB | 576 KB |
| Bootstrap ROM | 576 B | 576 bytes |
| Enhanced Filter Coprocessor (EFCOP) | Yes, parallel execution | — |
| DMA Channels | 6 | 6 channels |
| Serial Interfaces | Host Interface (HI), SSI, SCI | — |
| I/O Voltage | 3.30 V | 3.30 V |
| Input Logic Compatibility | TTL-compatible | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | — |
| Kemasan | 196-ball MAP-BGA (15x15 mm) | 196-MAPBGA (15 mm x 15 mm, 1 mm pitch, 1.18 mm body height) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Process Technology | High-density CMOS | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Part Number | — | DSP56321VF200 |
| Product Type | — | Fixed-Point Digital Signal Processor (DSP) |
| DSP Family | — | DSP56300 family, DSP56000 code-compatible |
| Core Architecture | — | 24-bit fixed-point, single-cycle engine |
| Clock Speed | — | 200 MHz |
| Instruction Cache | — | Yes |
| Coprocessor | — | Enhanced Filter Coprocessor (EFCOP) |
| Addressing | — | 24-bit address space, barrel shifter |
| Interfaces | — | Host Interface, SSI (Synchronous Serial), SCI (Serial Communications) |
| Suhu Hubungan Operasi | — | -40C to +100C (TJ) |
| Packaging | — | Tray |