EMC3R0N vs EMC5R0N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EMC3R0N disebabkan oleh SP Industrial dan EMC5R0N disebabkan oleh Silicon Power. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EMC3R0N | EMC5R0N |
|---|---|---|
| Merek | SP Industrial | Silicon Power |
| Kategori | eMMC | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | eMMC 5.1 managed NAND | eMMC 5.1 (JEDEC JESD84-B51) |
| NAND Technology | TLC NAND (with optional pSLC mode) | pSLC (pseudo-SLC, emulated from MLC/TLC) |
| Available Capacities | 32 GB, 64 GB, 128 GB | — |
| Host Interface | JEDEC eMMC 5.1, 8-bit, HS400 DDR | — |
| Sequential Read (max) | 320 MB/s | — |
| Sequential Write (max) | 240 MB/s | — |
| Program/Erase Cycles (TLC) | up to 3,000 P/E cycles per block | — |
| Suhu Operasi | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Storage Temperature | -40C to +85C | — |
| VCC Supply Voltage | 2.7 V to 3.6 V (typ. 3.3 V) | — |
| VCCQ I/O Voltage | 1.7 V to 1.95 V or 2.7 V to 3.6 V | — |
| Kemasan | BGA-153, 11.5 mm x 13 mm x 1.0 mm | 153-ball FBGA |
| Compliance | JEDEC eMMC 5.1 | — |
| Status RoHS | Compliant | Compliant |
| Controller Features | ECC, wear leveling, bad-block management, command queueing, secure boot | — |
| Boot Partition Support | Yes (boot partitions 1 and 2) | — |
| Write Protect | Hardware and software write protect supported | — |
| Density | — | 16 GB |
| Endurance (P/E Cycles) | — | up to 30,000 |
| Interface Bus Width | — | 1-bit / 4-bit / 8-bit MMC |
| Maximum Clock Rate | — | 200 MHz (HS400 mode) |
| Supply Voltage - Flash (VCC) | — | 2.7 V to 3.6 V |
| Supply Voltage - Interface (VCCQ) | — | 1.7 V to 1.95 V or 2.7 V to 3.6 V |
| Jenis Pemasangan | — | Surface Mount |
| Series | — | SP Industrial eMMC 5.1 Series |
| Family Variant | — | EMC5R0N (16GB pSLC); EMC3R0N (32/64/128GB TLC) |
| Managed NAND Features | — | Internal ECC, wear-leveling, secure erase/trim, write protection, partitions |