EP1K30FC256-3NAA vs EP1K30FC256-1 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1K30FC256-3NAA disebabkan oleh Intel dan EP1K30FC256-1 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP1K30FC256-3NAA EP1K30FC256-1
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete NRND
Product Category FPGA - Field Programmable Gate Array —
Family ACEX-1K ACEX-1K
Number of Logic Elements 1728 —
Number of Gates 30000 (30K) —
Embedded RAM Bits 24576 bits 24,576
Number of User I/Os 171 —
Maximum Internal Clock Frequency 200 MHz —
Core Supply Voltage 2.5 V —
IC Process Technology 0.22 um —
Package Type 256-ball FBGA (FineLine BGA) —
Package Form 256-BBGA —
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Speed Grade -3 (ordering code) -1 (standard, slowest in family)
Configuration Type SRAM-based, external configuration device required —
Gambaran Suhu Operasi [DATA_NEEDED: operating temperature range] —
I/O Supply Voltage [DATA_NEEDED: VCCIO voltage options] —
Power Dissipation [DATA_NEEDED: typical power dissipation, design dependent] —
Lead-Free / RoHS [DATA_NEEDED: manufacturer PCN confirms RoHS status] —
Logic Elements — 17,280
Typical Gates — 30,000
Logic Cells — 1,728
User I/O Pins — 171
Logic Array Blocks (LABs) — 216
Embedded Array Blocks (EABs) — 6
Core Voltage (VCCINT) — 2.5 V
I/O Voltage (VCCIO) — 3.3 V / 2.5 V (multi-voltage)
Operating Temperature Grade — Commercial (0C to +70C)
Maximum Internal Frequency — 250 MHz (per family datasheet)
Process Technology — 2.5 V CMOS
Kemasan — 256-pin FineLine BGA (FBGA)
Configuration Interface — Passive Serial / Passive Parallel / JTAG
Programming Method — SRAM-based, in-system programmable
Status RoHS — Compliant

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