EP1S30F780C8N vs EP1S30F780I6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1S30F780C8N disebabkan oleh Intel dan EP1S30F780I6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP1S30F780C8N - Stratix 32470 LEs FPGA, 597 I/O, 780-FBGA | Intel
EP1S30F780C8N ⚠ Bahagian terakhir untuk beliIntel
EP1S30F780I6N - Stratix FPGA, 32.5K LE, 780-BGA | Intel / Altera
EP1S30F780I6N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP1S30F780C8N | EP1S30F780I6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Family | Stratix | Stratix |
| Series | Stratix (EP1S) | — |
| Logic Elements (LEs) | 32,470 | — |
| Embedded Memory (RAM bits) | 3,317,184 | — |
| Total Memory Bits | 3,317,184 | — |
| User I/Os | 597 | — |
| LABs (Logic Array Blocks) | 3,247 | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Supply Voltage (Core) | 1.5 V | [DATA_NEEDED: core voltage] |
| Speed Grade | C8 (-8, faster bin) | -6 |
| Suhu Operasi | 0 °C to +85 °C (Commercial) | -40C to +100C (Industrial, I6) |
| Kemasan | 780-ball FC-FBGA (FineLine BGA), 29 × 29 mm, 1 mm pitch | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration | SRAM-based, JTAG / Passive Serial / Passive Parallel | — |
| Status RoHS | Compliant (per distributor listings) | — |
| Aras MSL | [DATA_NEEDED: MSL level] | 3 (per typical FBGA moisture sensitivity) |
| Logic Elements | — | 32,470 |
| Total RAM Bits | — | 3,317,184 bits |
| User I/O Count | — | 597 |
| Package Type | — | 780-BBGA, FCBGA (FineLine BGA) |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| Lead-Free / RoHS | — | Lead-free terminal finish (N suffix), RoHS-compliant |
| DSP Blocks | — | Yes (TriMatrix + DSP blocks per Stratix family) |
| JEDEC Code (e1) | — | e1 (Pb-free / matte tin) |