EP1S60F1020C6N vs EP1S60F1020C7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1S60F1020C6N disebabkan oleh Intel dan EP1S60F1020C7 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP1S60F1020C6N | EP1S60F1020C7 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Series | Stratix | Stratix |
| Family | Stratix (EP1S) | Stratix (EP1S60) |
| Logic Elements (LEs) | 57,120 | — |
| Logic Cells | 6,570 blocks (per chipdig datasheet summary) | — |
| Embedded RAM (Total Bits) | 5,215,104 bits | — |
| Embedded Multipliers | 773 (18x18) | — |
| Maximum User I/O Pins | Per datasheet, package-dependent (F1020 variant) | — |
| Package Type | 1020-ball FBGA (FineLine BGA), 33 x 33 mm, 1 mm pitch | — |
| Logic Family / Process | CMOS, 0.13 µm | — |
| Suhu Operasi | 0°C to +85°C (Commercial) | 0C to +85C (Commercial) |
| Tegangan Pemberi Arus | Per datasheet (Stratix Device Handbook Vol. 1) | — |
| Speed Grade | C6 (mid-tier) | 7 |
| Lead-Free / Pb-Free | Yes (suffix 'N') | — |
| Status RoHS | Compliant (per 'N' suffix) | Compliant (lead-free) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL rating] | 3 (per BGA moisture-sensitivity norms) |
| Configuration | JTAG / Passive Serial / Fast Passive Parallel via MSEL pins | — |
| PLL Count | 12 (per Stratix family datasheet) | — |
| Memory Block Types | TriMatrix (M512, M4K, M-RAM) | — |
| Logic Elements | — | 57,120 |
| Total Memory Bits | — | 5,215,104 |
| Maximum User I/O | — | 773 |
| Kemasan | — | 1020-BBGA, FCBGA, 33 x 33 mm, 1.0 mm pitch |
| Logic Family | — | CMOS |
| Core Supply Voltage | — | 1.5 V |
| Logic Cells / Logic Blocks | — | 6,570 (per datasheet Section I nomenclature) |
| DSP Blocks | — | Embedded dedicated multiplier / adder blocks |
| PLLs | — | Up to 12 enhanced PLLs per die |
| Configuration Method | — | Serial or parallel with optional decompression |