EP1SGX25DF67216 vs EP1SGX25DF672C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1SGX25DF67216 disebabkan oleh Altera dan EP1SGX25DF672C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
EP1SGX25DF672C7N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP1SGX25DF67216 | EP1SGX25DF672C7N |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Masa Terakhir Dibeli |
| Family | Stratix GX | — |
| Logic Elements | 25,660 | 25,660 |
| Total RAM Bits | 1,944,576 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Number of PLLs | 4 | — |
| Number of Transceiver Channels | 8 (4 in each of 2 banks) | — |
| Max Transceiver Data Rate | 3.1875 Gbps per channel | — |
| Min Transceiver Data Rate | 500 Mbps | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Auxiliary Supply Voltage | 3.3 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Maximum User I/O Pins | [DATA_NEEDED: user I/O count for DF672 package] | — |
| Kemasan | 672-ball FineLine BGA (DF672) | 672-ball FineLine BGA (FBGA-672) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Suhu Operasi | Industrial, -40C to +100C (I-suffix family) | 0 °C to 85 °C (Commercial) |
| On-Die Termination | Yes, 100-ohm differential | — |
| Pre-emphasis / Equalization | Programmable (transmitter pre-emphasis; receiver adaptive equalization) | — |
| Configuration Schemes | Passive serial, fast passive parallel, JTAG, Altera enhanced configuration | — |
| Status RoHS | Lead-free / RoHS compliant (per Altera product family documentation) | Compliant |
| Series | — | Stratix GX |
| Embedded Memory | — | 1,944,576 bits |
| Maximum User I/O | — | 455 |
| Number of Transceivers | — | 4 |
| Transceiver Data Rate (Max) | — | 3.125 Gbps |
| Process Technology | — | 130 nm CMOS |
| Package Dimensions | — | 33 × 33 mm, 1 mm pitch |
| Lead-Free / RoHS | — | Yes (lead-free, per datasheet) |
| Speed Grade | — | C7 |