EP1SGX25DF67216 vs EP1SGX25DF672C7N Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP1SGX25DF67216 tarafından Altera ve EP1SGX25DF672C7N tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Intel
EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
EP1SGX25DF672C7N ⚠ Son Satın AlmaÖzellik Karşılaştırması
| Parametre | EP1SGX25DF67216 | EP1SGX25DF672C7N |
|---|---|---|
| Marka | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Obsolete | Son Alış Zamanı |
| Family | Stratix GX | — |
| Logic Elements | 25,660 | 25,660 |
| Total RAM Bits | 1,944,576 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Number of PLLs | 4 | — |
| Number of Transceiver Channels | 8 (4 in each of 2 banks) | — |
| Max Transceiver Data Rate | 3.1875 Gbps per channel | — |
| Min Transceiver Data Rate | 500 Mbps | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Auxiliary Supply Voltage | 3.3 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Maximum User I/O Pins | [DATA_NEEDED: user I/O count for DF672 package] | — |
| Paket | 672-ball FineLine BGA (DF672) | 672-ball FineLine BGA (FBGA-672) |
| Montaj Türü | Surface Mount (BGA) | Surface Mount (BGA) |
| İşletim Sıcaklığı | Industrial, -40C to +100C (I-suffix family) | 0 °C to 85 °C (Commercial) |
| On-Die Termination | Yes, 100-ohm differential | — |
| Pre-emphasis / Equalization | Programmable (transmitter pre-emphasis; receiver adaptive equalization) | — |
| Configuration Schemes | Passive serial, fast passive parallel, JTAG, Altera enhanced configuration | — |
| RoHS Durumu | Lead-free / RoHS compliant (per Altera product family documentation) | Compliant |
| Series | — | Stratix GX |
| Embedded Memory | — | 1,944,576 bits |
| Maximum User I/O | — | 455 |
| Number of Transceivers | — | 4 |
| Transceiver Data Rate (Max) | — | 3.125 Gbps |
| Process Technology | — | 130 nm CMOS |
| Package Dimensions | — | 33 × 33 mm, 1 mm pitch |
| Lead-Free / RoHS | — | Yes (lead-free, per datasheet) |
| Speed Grade | — | C7 |