EP20K100CB356C8 vs EP20K100CF324C7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP20K100CB356C8 disebabkan oleh Intel dan EP20K100CF324C7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP20K100CB356C8 | EP20K100CF324C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | APEX 20K | FLEX 10K |
| Logic Elements | 4,160 | — |
| Typical Gates | 100,000 | — |
| Maximum User I/O | 252 | 246 |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Embedded Memory (EAB-based) | 24 Kbits | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | 0 °C to +70 °C (commercial) |
| Kemasan | 356-ball LBGA | 324-FBGA (FineLine BGA) |
| Process Technology | 0.18 µm CMOS | 0.22 µm CMOS SRAM |
| Configuration Modes | PS / PPS / PPA / JTAG (IEEE 1532) | — |
| Speed Grade | C8 | C7 (slowest commercial bin) |
| Status RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Series | — | EP20K100 |
| Logic Elements (LEs) | — | 4,160 |
| System Gates | — | 100,000 |
| Maximum RAM Bits | — | 49,152 |
| Supply Voltage - Core | — | 1.8 V |
| Supply Voltage - I/O | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Configuration Method | — | Serial PROM (EPC2/EPC4/EPC8) or JTAG |