EP20K100CB356C8 vs EP20K100CF324C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K100CB356C8 sa pamamagitan ng Intel at EP20K100CF324C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K100CB356C8 | EP20K100CF324C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | APEX 20K | FLEX 10K |
| Logic Elements | 4,160 | — |
| Typical Gates | 100,000 | — |
| Maximum User I/O | 252 | 246 |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Embedded Memory (EAB-based) | 24 Kbits | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | 0 °C to +70 °C (commercial) |
| Packhaging | 356-ball LBGA | 324-FBGA (FineLine BGA) |
| Process Technology | 0.18 µm CMOS | 0.22 µm CMOS SRAM |
| Configuration Modes | PS / PPS / PPA / JTAG (IEEE 1532) | — |
| Speed Grade | C8 | C7 (slowest commercial bin) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Series | — | EP20K100 |
| Logic Elements (LEs) | — | 4,160 |
| System Gates | — | 100,000 |
| Maximum RAM Bits | — | 49,152 |
| Supply Voltage - Core | — | 1.8 V |
| Supply Voltage - I/O | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Configuration Method | — | Serial PROM (EPC2/EPC4/EPC8) or JTAG |