EP20K400GC655-3 vs EP20K400GC655-2X Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP20K400GC655-3 disebabkan oleh Intel dan EP20K400GC655-2X disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP20K400GC655-3 - 400K Gate APEX-20KC FPGA 655-BCPGA | Intel
EP20K400GC655-3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP20K400GC655-3 | EP20K400GC655-2X |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Series | APEX-20KC | APEX-20KC® |
| Family | APEX 20K | APEX 20K |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 16640 | — |
| Total RAM Bits | 212992 | 212992 |
| Number of Gates | 400000 | — |
| Supply Voltage - Core | 1.71 V to 1.89 V (1.8 V nominal) | — |
| I/O Voltage Tolerance | MultiVolt I/O: 1.8 V / 2.5 V / 3.3 V / 5 V | — |
| Suhu Operasi | -40C to +85C (industrial) | [DATA_NEEDED: temperature grade] |
| Maximum Frequency | 167 MHz (per FPGAkey) | — |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS |
| Kemasan / Case | 655-BCPGA | — |
| Supplier Device Package | 655-CPGA (62.48 x 62.48 mm) | — |
| Speed Grade | -3 (slowest grade in family) | — |
| Propagation Delay (tPD) | 3.6 ns (per Microchip USA listing) | — |
| JTAG Support | IEEE 1149.1 Boundary-Scan | — |
| Configuration Modes | Passive Serial, Passive Parallel Sync/Async, Active Serial | — |
| Status RoHS | [DATA_NEEDED: rohs status] | unknown |
| Logic Elements / Cells | — | 16640 |
| System Gates | — | 400000 |
| Number of I/O | — | 496 |
| Number of Dedicated Inputs | — | 6 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of Logic Array Blocks] |
| Number of EABs | — | [DATA_NEEDED: number of Embedded Array Blocks] |
| Maximum Operating Frequency | — | 200 MHz |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage (MultiVolt) | — | 2.5 V / 3.3 V / 5 V |
| Package Type | — | 655-BCPGA (SPGA655) |
| Package Body Material | — | CERAMIC, metal-sealed cofired grid array |
| Package Dimensions | — | 47 x 47 mm |
| Peak Reflow Temperature | — | 220 °C |
| Jenis Pemasangan | — | Through-hole (CPGA) |
| Programmability | — | In-system, JTAG (IEEE 1149.1) |