EP20K400GC655-3X vs EP20K400GC655-2X Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP20K400GC655-3X disebabkan oleh Altera dan EP20K400GC655-2X disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP20K400GC655-3X | EP20K400GC655-2X |
|---|---|---|
| Merek | Altera | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Series | APEX-20KC | APEX-20KC® |
| Family | APEX 20K (MultiCore architecture, LUT + product-term + embedded memory) | APEX 20K |
| Manufacturer | Altera (now Intel FPGA) | — |
| Logic Elements / Cells | 16,640 | 16640 |
| System Gates | 400,000 | 400000 |
| Total RAM Bits | 212,992 bits | 212992 |
| Maximum Internal Frequency | 167 MHz (speed grade -3) | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V | — |
| I/O Supply Voltage (VCCIO) | 2.5 V (LVDS support per APEX 20KE datasheet) | — |
| Kemasan / Case | 655-BCPGA (CPGA655, 62.48 x 62.48 mm) | — |
| Jenis Pemasangan | Through-Hole (CPGA, ceramic) | Through-hole (CPGA) |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: temperature grade] |
| Speed Grade | -3 (fastest) | — |
| Suffix Code | -X (extended / ceramic CPGA variant) | — |
| I/O Count | [DATA_NEEDED: max user I/O] | — |
| JTAG / Boundary Scan | IEEE 1149.1 (per APEX 20K family) | — |
| Status RoHS | [DATA_NEEDED: RoHS status - ceramic CPGA historically non-RoHS] | unknown |
| Number of I/O | — | 496 |
| Number of Dedicated Inputs | — | 6 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of Logic Array Blocks] |
| Number of EABs | — | [DATA_NEEDED: number of Embedded Array Blocks] |
| Maximum Operating Frequency | — | 200 MHz |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage (MultiVolt) | — | 2.5 V / 3.3 V / 5 V |
| Package Type | — | 655-BCPGA (SPGA655) |
| Package Body Material | — | CERAMIC, metal-sealed cofired grid array |
| Package Dimensions | — | 47 x 47 mm |
| Peak Reflow Temperature | — | 220 °C |
| Programmability | — | In-system, JTAG (IEEE 1149.1) |