EP2A40F672I-9 vs EP2A40F672C9N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A40F672I-9 disebabkan oleh Intel dan EP2A40F672C9N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2A40F672I-9 | EP2A40F672C9N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | APEX II | APEX II |
| Device | EP2A40 | — |
| Logic Elements | 38,400 | 38,400 |
| System Gates | 1,500,000 | 1,500,000 |
| Maximum Operating Frequency | 366 MHz | — |
| Process Technology | 0.15 µm CMOS | 0.15 µm all-layer copper, up to 8 metal layers |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) | — |
| Suhu Operasi | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (commercial) |
| Kemasan | 672-pin FC-FBGA (Fine-pitch Ball Grid Array) | BGA-672 (27 x 27 mm, 1.0 mm pitch) |
| Speed Grade | -9 | C9 (~1.55 ns propagation delay) |
| True-LVDS Channels | Yes (dedicated) | — |
| Embedded Memory | Dual-port RAM, single-port RAM, ROM, CAM (via ESBs) | — |
| Hot Socketing | Supported | — |
| Configuration Mode | Passive serial, passive parallel synchronous, passive parallel asynchronous, JTAG | — |
| Moisture Sensitivity Level | MSL 3 | — |
| Peak Reflow Temperature | 220 °C | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Device Name | — | EP2A40 |
| User I/Os | — | 492 |
| Embedded RAM (ESB) | — | [DATA_NEEDED: ESB total RAM bits] |
| Package Code | — | FC-FBGA / PBGA672 |
| Core Voltage | — | 1.5 V |
| Internal Frequency | — | 366 MHz |
| LVDS Data Rate | — | 1 Gbps |
| Propagation Delay | — | 1.55 ns |
| Jenis Pemasangan | — | Surface Mount |
| Logic Family | — | CMOS (SRAM-based configuration) |