EP2AGX125EF35C4G vs EP2AGX125EF35I5G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX125EF35C4G disebabkan oleh Intel dan EP2AGX125EF35I5G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2AGX125EF35C4G - Arria II GX FPGA, 118K LEs, 1152-FCBGA | Intel
EP2AGX125EF35C4G ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP2AGX125EF35C4G | EP2AGX125EF35I5G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Family | Arria II GX | — |
| Logic Elements | 118,143 | 118,143 |
| Embedded Memory Bits | 8,315,904 | — |
| Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| Hardware Multipliers (18x18) | 452 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP count] |
| Transceiver Channels | 12 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| PCI Express Hard IP | Gen1/Gen2 x1/x4/x8 | — |
| Core Voltage | 0.9 V | 0.87 V (Min) |
| User I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Process Technology | 40 nm | — |
| Kemasan | 1152-ball FC-FBGA (Flip-Chip) | 1152-FBGA, FCBGA (35 mm) |
| Suhu Operasi | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Configuration Method | SRAM-based, PS/FPP/JTAG | — |
| Status RoHS | Compliant | Compliant |
| Speed Grade | C4 | -5 |
| Lead-Free | Yes | — |
| Series | — | Arria II GX |
| Embedded Memory | — | 8,315,904 bits (7.93 Mbits) |
| User I/O Pins | — | 452 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Transceivers | — | 12 channels, up to 6.375 Gbps |
| PCIe Hard IP | — | 4 blocks, Gen1/Gen2 |
| PLLs | — | 8 |
| Process Node | — | 40 nm low-power |
| Total Memory Bits | — | 8,315,904 |