EP2AGX125EF35C4G vs EP2AGX125EF35I5G 对比
详细并排对比 EP2AGX125EF35C4G 出自 Intel 和 EP2AGX125EF35I5G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2AGX125EF35C4G | EP2AGX125EF35I5G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,290.00 | $1,190.00 |
| Family | Arria II GX | — |
| Logic Elements | 118,143 | 118,143 |
| Embedded Memory Bits | 8,315,904 | — |
| Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| Hardware Multipliers (18x18) | 452 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP count] |
| Transceiver Channels | 12 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| PCI Express Hard IP | Gen1/Gen2 x1/x4/x8 | — |
| Core Voltage | 0.9 V | 0.87 V (Min) |
| User I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Process Technology | 40 nm | — |
| 封装 | 1152-ball FC-FBGA (Flip-Chip) | 1152-FBGA, FCBGA (35 mm) |
| 工作温度 | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Configuration Method | SRAM-based, PS/FPP/JTAG | — |
| RoHS 状态 | Compliant | Compliant |
| Speed Grade | C4 | -5 |
| Lead-Free | Yes | — |
| Series | — | Arria II GX |
| Embedded Memory | — | 8,315,904 bits (7.93 Mbits) |
| User I/O Pins | — | 452 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Transceivers | — | 12 channels, up to 6.375 Gbps |
| PCIe Hard IP | — | 4 blocks, Gen1/Gen2 |
| PLLs | — | 8 |
| Process Node | — | 40 nm low-power |
| Total Memory Bits | — | 8,315,904 |