EP2AGX260EF29I5N vs EP2AGX260EF29C5G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX260EF29I5N disebabkan oleh Intel dan EP2AGX260EF29C5G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGX260EF29I5N | EP2AGX260EF29C5G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Aktif |
| Series | Arria II GX | — |
| Family | Arria II | Arria II GX |
| Logic Elements | 244,188 | — |
| Adaptive Logic Modules (ALMs) | 10260 LABs | — |
| Embedded Memory Bits | 12,038,144 bits | — |
| Maximum User I/O | 372 | — |
| Number of I/O | 372 | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate (CPLL) | up to 3.75 Gbps | — |
| Transceiver Data Rate (Channel PLL) | up to 5 Gbps | — |
| 18x18 Multipliers | 1,152 | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 5 | C5 (commercial -5C to 85C) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip BGA) | — |
| Package Dimensions | 29 mm x 29 mm | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED] |
| Lead Free | Yes | — |
| Status RoHS | Compliant | — |
| Process Technology | CMOS | — |
| Configuration | JTAG / passive serial / fast passive parallel | — |
| Logic Elements (LE) | — | 260,000 |
| Total Memory Bits | — | 12,038,144 bits |
| Embedded RAM Bits | — | 244,188 bits |
| Number of LABs | — | 10,260 |
| User I/O Count | — | 372 |
| Kemasan | — | 780-ball FBGA (FineLine BGA) |
| Package Code | — | HBGA, 29 mm |
| Process Node | — | 40 nm |
| Supply Voltage - Core | — | [DATA_NEEDED: VCCINT nominal] |
| Transceivers | — | Multi-gigabit transceivers (MGTs), count [DATA_NEEDED] |
| DSP Blocks | — | 18x18 multipliers, count [DATA_NEEDED] |
| Suhu Operasi | — | 0C to 85C (commercial) |
| Lead-Free / RoHS | — | Yes (G suffix) |