EP2AGX260FF35I3G vs EP2AGZ300FF35I3G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX260FF35I3G disebabkan oleh Intel dan EP2AGZ300FF35I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2AGX260FF35I3G EP2AGX260FF35I3G - Arria II GX FPGA, 244K LE, 1152-FBGA | Intel

EP2AGX260FF35I3G - Arria II GX FPGA, 244K LE, 1152-FBGA | Intel

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Pengandingan Spesifikasi

Parametr EP2AGX260FF35I3G EP2AGZ300FF35I3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Aktif
Device Family Arria II GX —
Logic Elements 244188 —
Embedded Memory Bits 12038144 —
Maximum User I/O 612 —
Kemasan 1152-BBGA, FCBGA 1152-ball FBGA (FF35)
Process Technology 40 nm —
Core Supply Voltage 0.9 V —
Speed Grade I3 —
Suhu Operasi -40 C to +100 C (Industrial) -40C to +100 C (I3 industrial)
Jenis Pemasangan Surface Mount Surface Mount
Configuration JTAG / Active Serial / Passive Serial / FPP —
DSP Blocks [DATA_NEEDED: DSP block count] [DATA_NEEDED: number of DSP blocks]
Transceivers [DATA_NEEDED: number of transceiver channels] —
Lead-Free (RoHS) Yes (G suffix indicates Pb-free finish) —
Tray Standard Quantity [DATA_NEEDED: tray qty] —
Family — Arria II GZ
Logic Elements (LE) — 300000
Number of User I/O — 554 (maximum)
Number of Transceivers — 8
Transceiver Data Rate — Up to 6.375 Gbps
Process Node — 40 nm
Tegangan Pemberi Arus — [DATA_NEEDED: core and I/O supply voltage values]
Embedded Memory (Mbits) — 16.4
PLLs — [DATA_NEEDED: number of PLLs]
Memory Interfaces — DDR3, QDRII+, RLDRAM II
Configuration Method — Serial, Parallel, JTAG
Status RoHS — Compliant
Aras MSL — 3 (168 hours)
Lead-Free — Yes

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