EP2AGX95EF35C6G vs EP2AGX95EF35I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX95EF35C6G disebabkan oleh Intel dan EP2AGX95EF35I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGX95EF35C6G | EP2AGX95EF35I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Product Family | Arria II GX | — |
| Logic Elements | 89,178 | 89,178 |
| Embedded Memory | 6,839,296 bits | — |
| User I/O | 452 | — |
| Kemasan | 1152-BBGA, FCBGA | 1152-ball FCBGA |
| Package Type | Ball Grid Array | — |
| Manufacturer | Altera / Intel | — |
| Core Voltage | [DATA_NEEDED: core voltage] | 0.9 V |
| Suhu Operasi | [DATA_NEEDED: operating temperature] | — |
| Frekuensi Klock Maksimum | [DATA_NEEDED: maximum clock frequency] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| Transceiver Data Rate | [DATA_NEEDED: transceiver data rate] | — |
| Power Dissipation | [DATA_NEEDED: power dissipation] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Family | — | Arria II GX |
| Embedded Memory Bits | — | 6,839,296 |
| User I/O Count | — | 452 |
| Process Technology | — | 40 nm |
| Operating Frequency (max) | — | 500 MHz |
| Temperature Grade | — | Industrial (I3) |
| Junction Temperature | — | -40 °C to +100 °C |
| Transceivers | — | Up to 16 (6.375 Gbps) |
| DSP Blocks | — | 18x18 multipliers |
| External Memory Support | — | DDR2/DDR3 |
| Jenis Pemasangan | — | Surface Mount (BGA) |