EP2AGZ225FF35C3G vs EP2AGZ225FF35I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ225FF35C3G disebabkan oleh Altera dan EP2AGZ225FF35I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ225FF35C3G | EP2AGZ225FF35I3N |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GZ | Arria II GZ |
| Series | Arria II | — |
| Logic Elements (LE) | 225,000 | 224,000 |
| Kemasan | 1152-ball Flip-Chip BGA (FF35) | 1152-ball FC-FBGA |
| Package Size | 35 mm x 35 mm | — |
| Suhu Operasi | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Speed Grade | C3 | — |
| Transceivers | Up to 16 channels | — |
| Transceiver Data Rate (max) | 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: count] | — |
| Embedded Memory | [DATA_NEEDED: Mbits] | 14,248,960 bits (approx. 14.25 Mbit) |
| User I/O Banks | [DATA_NEEDED: count] | — |
| Maximum User I/O | [DATA_NEEDED: pin count] | 554 |
| Process Technology | 40 nm TSMC | 40 nm |
| Memory Controller Support | DDR3, DDR2, QDR II+ | — |
| PCI Express Hard IP | Yes (Gen1/Gen2) | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL rating] |
| Lead-Free | Yes | — |
| Logic Array Blocks (LABs) | — | 8,960 |
| User I/O Count | — | 554 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Transceiver Channels | — | 24 |
| Core Voltage | — | 0.9 V |
| Configuration Method | — | SRAM-based (volatile, requires external config device) |