EP2AGZ225FF35C3G vs EP2AGZ225FF35I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225FF35C3G sa pamamagitan ng Altera at EP2AGZ225FF35I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ225FF35C3G | EP2AGZ225FF35I3N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Series | Arria II | — |
| Logic Elements (LE) | 225,000 | 224,000 |
| Packhaging | 1152-ball Flip-Chip BGA (FF35) | 1152-ball FC-FBGA |
| Package Size | 35 mm x 35 mm | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Speed Grade | C3 | — |
| Transceivers | Up to 16 channels | — |
| Transceiver Data Rate (max) | 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: count] | — |
| Embedded Memory | [DATA_NEEDED: Mbits] | 14,248,960 bits (approx. 14.25 Mbit) |
| User I/O Banks | [DATA_NEEDED: count] | — |
| Maximum User I/O | [DATA_NEEDED: pin count] | 554 |
| Process Technology | 40 nm TSMC | 40 nm |
| Memory Controller Support | DDR3, DDR2, QDR II+ | — |
| PCI Express Hard IP | Yes (Gen1/Gen2) | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL rating] |
| Lead-Free | Yes | — |
| Logic Array Blocks (LABs) | — | 8,960 |
| User I/O Count | — | 554 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Transceiver Channels | — | 24 |
| Core Voltage | — | 0.9 V |
| Configuration Method | — | SRAM-based (volatile, requires external config device) |