EP2AGZ225HF40I3N vs EP2AGZ300HF40I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ225HF40I3N disebabkan oleh Intel dan EP2AGZ300HF40I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ225HF40I3N | EP2AGZ300HF40I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Arria II GZ | EP2AGZ |
| Logic Elements (LE) | 224,000 | 298,000 |
| Embedded Memory (bits) | 14,248,960 | — |
| User I/O | 734 | — |
| Logic Array Blocks (LABs) | 8,960 | — |
| Embedded Multipliers (18x18) | 736 | — |
| Transceiver Data Rate (max) | 6.375 Gbps | — |
| Speed Grade | I3 (industrial, -3) | — |
| Suhu Operasi | -40C to +100C (industrial) | — |
| Package Type | 1517-BBGA, FCBGA (flip-chip BGA) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Process Technology | 40 nm TSMC | 40 nm |
| Configuration Memory | SRAM-based, volatile (requires external configuration device) | — |
| PCIe Hard IP | PCIe Gen1/Gen2 | — |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | 0.9 V |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Series | — | Arria II GZ |
| Embedded Memory Bits | — | 18,854,912 |
| User I/O Count | — | 734 |
| Kemasan | — | 1517-BBGA, FCBGA (HF40) |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Number of PLLs | — | 4 |
| Configuration Interface | — | Passive Serial / Fast Passive Parallel / JTAG |
| Bitstream Encryption | — | AES-256 |