EP2AGZ225HF40I3N vs EP2AGZ350HF40I3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ225HF40I3N disebabkan oleh Intel dan EP2AGZ350HF40I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2AGZ225HF40I3N EP2AGZ350HF40I3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Arria II GZ Arria II GZ
Logic Elements (LE) 224,000 —
Embedded Memory (bits) 14,248,960 —
User I/O 734 —
Logic Array Blocks (LABs) 8,960 —
Embedded Multipliers (18x18) 736 —
Transceiver Data Rate (max) 6.375 Gbps —
Speed Grade I3 (industrial, -3) —
Suhu Operasi -40C to +100C (industrial) -40C to +100C (Industrial)
Package Type 1517-BBGA, FCBGA (flip-chip BGA) —
Jenis Pemasangan Surface Mount —
Process Technology 40 nm TSMC 40 nm TSMC
Configuration Memory SRAM-based, volatile (requires external configuration device) —
PCIe Hard IP PCIe Gen1/Gen2 —
Supply Voltage (Core) [DATA_NEEDED: core voltage] —
Status RoHS [DATA_NEEDED: RoHS status] Compliant
Logic Elements — 348,500
Adaptive Logic Modules (ALMs) — 139,400
Embedded Memory Bits — 21,270,528 bits
Embedded Memory Blocks — 950 M20K blocks
DSP Blocks — 768 (18x18 multipliers)
User I/O Pins — 13,940
Transceivers — 24 channels up to 6.375 Gbps
Hard PCIe Controllers — 4 x Gen2
Hard Memory Controllers — 8 DDR3 controllers up to 800 MHz
PLLs — 16 (8 fPLL + 8 GPLL)
Core Voltage — 0.9 V
Kemasan — 1517-BBGA, FCBGA (HF40) 40 x 40 mm
Configuration Modes — Passive Serial, Fast Passive Parallel, JTAG, AES-256

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