EP2AGZ350HF40C3G vs EP2AGZ300HF40C3G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ350HF40C3G disebabkan oleh Intel dan EP2AGZ300HF40C3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2AGZ350HF40C3G EP2AGZ300HF40C3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Arria II GZ —
Manufacturer Intel (formerly Altera) Intel (formerly Altera)
Logic Elements (LEs) 350,000 —
Embedded Memory [DATA_NEEDED: total embedded memory bits] Approx. 18.7 Mbits
DSP Blocks [DATA_NEEDED: DSP block count and 18x18 multiplier count] 800+ (18x18 multipliers)
User I/O Pins 734 —
Kemasan 1517-ball FineLine BGA (HF40) 1517-ball FBGA
Package Pitch 1.0 mm —
Process Node 40 nm —
Speed Grade C3 (commercial, -3) C3 (commercial)
Suhu Operasi Commercial (0C to 85C, suffix 0C) Commercial (0C to +85C)
Transceivers Up to 6.375 Gbps (channel count [DATA_NEEDED]) —
External Memory Interfaces DDR3, DDR2, QDR II+ (up to 800 MHz) —
PCI Express Hard Blocks Yes (Gen1/Gen2) —
Jenis Pemasangan Surface Mount (BGA) Surface Mount (BGA)
Status RoHS Compliant Pb-free finish - compliant
Lead-Free Yes —
Aras MSL [DATA_NEEDED: MSL rating] —
Series — Arria II GZ
Logic Elements (LE) — 300,000
User I/O Count — 734
Lead Finish — Pb-free (G suffix)
Multi-Gigabit Transceivers — 24 (up to 6.375 Gbps)
PLLs — 8
Hard Memory Controllers — DDR3, QDRII+, RLDRAM II
PCIe Hard IP — PCIe Gen2 (x1/x4/x8)
Process Technology — 40 nm TSMC
Configuration Method — Serial/Parallel, partial reconfiguration supported

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