EP2AGZ350HF40I3 vs EP2AGZ350HF40I2N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ350HF40I3 disebabkan oleh Intel dan EP2AGZ350HF40I2N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ350HF40I3 | EP2AGZ350HF40I2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 350000 |
| Adaptive Logic Modules (ALMs) | 139,400 | — |
| Embedded Memory Bits | 21,270,528 bits | — |
| Embedded Memory Blocks | 950 M20K blocks | — |
| DSP Blocks | 768 (18x18 multipliers) | [DATA_NEEDED: DSP block count] |
| User I/O Pins | 13,940 | — |
| Transceivers | 24 channels up to 6.375 Gbps | Embedded multi-gigabit transceivers |
| Hard PCIe Controllers | 4 x Gen2 | — |
| Hard Memory Controllers | 8 DDR3 controllers up to 800 MHz | — |
| PLLs | 16 (8 fPLL + 8 GPLL) | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage | 0.9 V | — |
| Kemasan | 1517-BBGA, FCBGA (HF40) 40 x 40 mm | 1517-pin FBGA (HF40) |
| Suhu Operasi | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG, AES-256 | — |
| Status RoHS | Compliant | Compliant |
| Supply Voltage (Core) | — | [DATA_NEEDED: core Vcc] |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Embedded Memory | — | [DATA_NEEDED: Mbits] |
| User I/O Banks | — | [DATA_NEEDED: bank count] |
| Maximum User I/O | — | [DATA_NEEDED: max user I/O count] |
| Process Node | — | [DATA_NEEDED: process node nm] |
| Lead-Free | — | Yes |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |
| AEC-Q100 | — | not_applicable |