EP2C20F256C8N vs EP2C15AF256C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2C20F256C8N disebabkan oleh Intel dan EP2C15AF256C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2C20F256C8N - Cyclone II FPGA, 18,752 LEs, 256-FBGA | Intel
EP2C20F256C8N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2C20F256C8N | EP2C15AF256C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Series | Cyclone II | — |
| Family | Cyclone II FPGA | Cyclone II |
| Logic Elements (LEs) | 18,752 | — |
| Total RAM Bits | 239,616 bits | 239,616 |
| Embedded Multipliers (18x18) | 152 | [DATA_NEEDED: multiplier count] |
| Maximum User I/O Pins | 315 (device maximum, package-dependent) | — |
| User I/O Pins on F256 Package | [DATA_NEEDED: exact F256 I/O count] | — |
| Number of PLLs | 4 | [DATA_NEEDED: PLL count] |
| Global Clock Networks | 16 | — |
| Process Technology | 90 nm CMOS | — |
| Core Voltage (VCCINT) | 1.2 V (1.15 V to 1.25 V range) | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Speed Grade | C8 | C8 |
| Kemasan | 256-ball FineLine BGA (FBGA-256, F256) | 256-LBGA (FBGA-256) |
| Suhu Operasi | Commercial (0C to +85C) | 0 C to 85 C |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Lead-Free (Pb-Free) | Yes (N suffix) | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 14,448 |
| Maximum User I/O | — | 152 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Number of Logic Elements / Cells | — | 14448 |
| Core Supply Voltage | — | 1.2 V |
| Lead-Free | — | Yes (N suffix) |
| Process Node | — | 90 nm |
| Configuration Memory | — | SRAM (external EPCS flash required) |
| I/O Standards Supported | — | LVDS, LVCMOS, SSTL, HSTL |