EP2C20F256C8N vs EP2C15AF256C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2C20F256C8N sa pamamagitan ng Intel at EP2C15AF256C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2C15AF256C8N - 15K LEs Cyclone II FPGA, 256-FBGA | Intel / Altera
EP2C15AF256C8N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2C20F256C8N | EP2C15AF256C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Series | Cyclone II | — |
| Family | Cyclone II FPGA | Cyclone II |
| Logic Elements (LEs) | 18,752 | — |
| Total RAM Bits | 239,616 bits | 239,616 |
| Embedded Multipliers (18x18) | 152 | [DATA_NEEDED: multiplier count] |
| Maximum User I/O Pins | 315 (device maximum, package-dependent) | — |
| User I/O Pins on F256 Package | [DATA_NEEDED: exact F256 I/O count] | — |
| Number of PLLs | 4 | [DATA_NEEDED: PLL count] |
| Global Clock Networks | 16 | — |
| Process Technology | 90 nm CMOS | — |
| Core Voltage (VCCINT) | 1.2 V (1.15 V to 1.25 V range) | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Speed Grade | C8 | C8 |
| Packhaging | 256-ball FineLine BGA (FBGA-256, F256) | 256-LBGA (FBGA-256) |
| Temperature na Operasyon | Commercial (0C to +85C) | 0 C to 85 C |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Lead-Free (Pb-Free) | Yes (N suffix) | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 14,448 |
| Maximum User I/O | — | 152 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Number of Logic Elements / Cells | — | 14448 |
| Core Supply Voltage | — | 1.2 V |
| Lead-Free | — | Yes (N suffix) |
| Process Node | — | 90 nm |
| Configuration Memory | — | SRAM (external EPCS flash required) |
| I/O Standards Supported | — | LVDS, LVCMOS, SSTL, HSTL |