EP2C50U484C8 vs EP2C50U484C6 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2C50U484C8 disebabkan oleh Intel dan EP2C50U484C6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2C50U484C8 | EP2C50U484C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Cyclone II | Cyclone II |
| Logic Elements | 50,528 | 50,528 |
| Logic Array Blocks (LABs) | 3,158 | — |
| Embedded Memory Bits | 594,432 | — |
| M4K RAM Blocks | 250 (4 Kbit each) | 250 |
| Embedded 18x18 Multipliers | 86 | 86 |
| PLLs | 4 | 4 |
| User I/O Pins | 294 (132 differential pairs max) | — |
| Process Node | 90 nm CMOS | — |
| Kemasan | 484-ball FineLine BGA (UBGA-484), 19 x 19 mm, 1.0 mm pitch | 484-ball FineLine BGA (U484), 19x19 mm, 1.0 mm pitch |
| Speed Grade | C8 (-8 speed bin) | C6 (commercial, -6) |
| Suhu Operasi | 0 °C to +85 °C (Commercial) | 0C to +85C (commercial) |
| Core Voltage | 1.15 V to 1.25 V | — |
| Configuration Modes | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) | — |
| Lead-Free / RoHS | Lead-free (UBGA package), RoHS compliant | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Embedded Memory (bits) | — | 594,432 |
| Maximum User I/O | — | 294 |
| Process Technology | — | 90 nm CMOS SRAM |
| Core Supply Voltage | — | 1.2 V |
| Configuration Method | — | AS, PS, JTAG |
| Status RoHS | — | Compliant |