EP2C5F256C8N vs EP2C5F256C6 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2C5F256C8N disebabkan oleh Intel dan EP2C5F256C6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2C5F256C8N - Cyclone II FPGA, 4.6K LEs, 158 I/O | Altera / Intel
EP2C5F256C8N ⚠ Bahagian terakhir untuk beliIntel
EP2C5F256C6 - Cyclone II FPGA, 4,608 LEs, 158 I/O | Intel
EP2C5F256C6 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2C5F256C8N | EP2C5F256C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 4,608 | — |
| Logic Array Blocks (LAB) | 288 | — |
| Embedded Memory (M4K blocks) | 119,808 bits (~14.6 Kbytes) | — |
| Embedded 18x18 Multipliers | 13 | 13 |
| PLLs | 2 | 2 |
| Maximum User I/O Pins | 158 | — |
| Process Technology | 90 nm low-k CMOS | 90 nm CMOS (low-k dielectric) |
| Core Voltage | 1.2 V | — |
| Speed Grade | 8 (commercial) | C6 |
| Kemasan | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (F256, 1.0 mm pitch) |
| Suhu Operasi | 0C to +85C (commercial) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), Passive Serial | — |
| Aras MSL | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | [DATA_NEEDED: MSL rating] |
| Status RoHS | Compliant (lead-free) | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 4,608 |
| Total RAM Bits | — | 119,808 |
| Number of M4K Memory Blocks | — | 26 (4 kbit each) |
| Maximum User I/O | — | 158 |
| Gambaran Suhu Operasi | — | 0°C to 85°C (TJ, commercial) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core VCC voltage] |
| Configuration Modes | — | AS, PS, JTAG |